Our Valuable Partner
Why Choose PCBMay for BGA Assembly Service?
- High-Precision BGA Placement – 8 SMT assembly line capable of 2 mm and ball diameter as small as 0.14 mm placing BGA components.
- Advanced Thermal Profiling – We utilize controlled reflow profiles tailored to each board to ensure strong, flawless solder joints.
- Industry-Standard Lead-Free Paste –BGA assemblies uses standard lead-free solder paste to deliver strong mechanical bonds and complete environmental compliance.
- Zero-Void Via-in-Pad Processing – We offer epoxy-filled and capped vias to create perfectly flat soldering surfaces, preventing solder migration and eliminating voiding risks under the BGA.
- Full ESD Protection Protocols – Safe static-controlled environments safeguard sensitive BGA components from electrostatic damage during every stage of handling and assembly
- Professional BGA Rework Services – Full rework support for component replacement, reballing and pad repair to maximize yield for high-value assemblies.
What is BGA Assembly?
BGA (Ball Grid Array) assembly mounts advanced microchips like CPUs and GPUs directly to a circuit board. Instead of traditional metal pins on the sides, these components use a grid of tiny solder balls on their underside. BGA assembly serves as a crucial, space-saving step that lets you pack maximum processing power and high pin counts into compact, modern electronics efficiently.
PCBMay provides reliable BGA PCB assembly services built to handle your precision component layout, thermal profiling, and advanced soldering needs under one roof. Whether you need a quick prototype batch or high-volume production runs, our facility delivers the quality and electrical reliability your complex BGA project demands.
Send us your Gerber files and Bill of Materials (BOM) today for a professional review and a competitive quote on your BGA PCB assembly project.
BGA Assembly Types
BGA assembly is categorized by the substrate material, ball spacing, and structural layout of the component package. Choosing the right type depends on your project’s thermal demands, space limits, and circuit performance needs.
Features a plastic or resin substrate. It is the standard, most cost-effective choice for everyday consumer electronics, offering excellent compatibility with standard PCB materials.
Utilizes a ceramic base that handles extreme temperatures and offers superior electrical performance. It is ideal for heavy-duty applications like military, aerospace, and high-end servers.
Uses a flexible polyimide tape substrate to achieve an ultra-thin profile. It is commonly used in portable and space-constrained electronic devices.
Connects the die facedown without wire bonds, shortening signal paths to maximize speed and cooling for high-performance GPUs and CPUs.
Standardizes a smaller spacing (pitch) between solder balls, typically under 1.0 mm. It packs dense connections into a tight footprint for memory chips and compact computing.
Places two distinct, fully enclosed BGA packages directly on top of each other during the board assembly process. It allows components like a CPU and RAM to sit stacked together, maximizing processing speeds and saving space.
PCBMay Service Advantage for Your BGA Assembly
Below are the core advantages PCBMay provides to streamline your BGA assembly and help guarantee a successful BGA assembly service.
PCBMay checks your design files before production begins, catching footprint layout errors and pad design mismatches early to eliminate manufacturing defects.
Ordering is completely flexible, allowing you to request small BGA assembly prototype batches or full mass production runs based entirely on your budget and timeline.
Production schedules are optimized to move your complex BGA designs quickly from engineering to completion, minimizing your time-to-market for urgent deadlines.
Every BGA board undergoes a strict verification process using Automated Optical Inspection (AOI) for superficial alignment, X-ray inspection for hidden solder joints under the BGA package.
BGA Assembly Applications
BGA assembly is applied in these high-performance electronics industries:
Powering smartphones, tablets, laptops, and gaming consoles, maximizing space and maximizing processing performance matter.
Integrated into engine control units, ADAS systems, and infotainment setups. These automotive assemblies are built to meet stringent reliability requirements.
Essential for patient monitoring systems, advanced diagnostic equipment, and high-stakes implantables, providing the precise reliability required for FDA Class II and III devices.
Found in high-performance servers, massive storage systems, and advanced networking equipment, where Flip-Chip BGA (FC-BGA) packages dominate high-performance processors.
BGA Assembly Case Studies
Below are some samples of how we helped our clients with high-precision BGA (Ball Grid Array) assembly services.
Our industrial robotics client needed a highly integrated core computing module capable of heavy data processing. The main manufacturing challenge was dealing with an ultra-fine 0.4mm pitch BGA package for the main SoC controller. At this density, the window for error in solder paste printing is incredibly small. We used high-precision laser-cut stepped stencils and automated 3D SPI (Solder Paste Inspection) to ensure the exact volume of paste was deposited on every single pad. By maintaining a placement accuracy of ±0.035 mm, we eliminated the risk of bridging or short circuits under the component, ensuring flawless high-speed communication between the SoC and the onboard DDR memory.
Technical Specifications
- Layer Count: 6 Layers
- Material: Shengyi S1000-2 (High-Tg 170°C, Industrial Grade)
- Board Thickness: 1.6 mm
- Copper Thickness: Outer Layers: 1 oz / Inner Layers: 1 oz
- Min Line/Spacing: 3.5 mil / 3.5 mil
- Surface Finish: Immersion Gold
- Placement Accuracy: ±0.035 mm
- Minimum BGA Pitch: 0.4 mm
- BGA Packages: Fine-Pitch BGA (FBGA) for Main SoC & Onboard DDR/NAND Flash Memory
- Application: Industrial Robotics Core Computing Module (SoM)
For this project, the client required a rugged, high-reliability central controller to handle real-time motion and data processing. Because this board operates in harsh industrial environments under continuous vibration, the assembly had to meet strict IPC Class 3 standards. The manufacturing challenge centered on achieving perfect thermal uniformity across a mix of heavy PBGA components and tiny Micro BGA devices. We designed a highly customized reflow oven thermal profile, carefully controlling the ramp-up and cooling rates. This ensured strong, void-free solder joints across all BGA balls without putting thermal stress on the internal logic devices or the premium Isola substrate.
Technical Specifications
- Layer Count: 4 Layers
- Material: Isola 370HR
- Board Thickness: 1.6 mm
- Copper Thickness: Outer Layers: 1 oz / Inner Layers: 1 oz
- Min Line/Spacing: 3.5 mil / 3.5 mil
- Surface Finish: Immersion Gold
- Placement Accuracy: ±0.035 mm
- Minimum BGA Pitch: 0.5 mm
- BGA Packages: PBGA, Micro BGA for onboard memory & logic devices
- Certifications: ISO 9001 Certified, UL 94V-0, IPC Class 3 Qualified
- Application: Industrial Robotics Central Motion & Data Processing Controller
More About PCBMay
Check PCBMay BGA assembly capabilities in the following table:
- BGA PCB Assembly Capabilities
- Video
- Factory Gallery
| Capability Area | Capability |
| Supported Package Types | PBGA, CBGA, MBGA, CTBGA, CABGA, VFBGA, Leaded BGA, Leadless BGA, LGA, CSP, WLCSP, Stacked Packages, and other BGA package types. |
| Minimum BGA Pitch | Supports BGA pitch down to 0.2 mm and ball diameter as small as 0.14 mm. |
| PCB Size | Custom board sizes supported according to project requirements. |
| Component Sourcing | Full Turnkey, Partial Turnkey, and Kitted/Consigned assembly options available. |
| Inspection & Testing | X-ray inspection, AOI (Automated Optical Inspection), and Functional Testing for assembly verification. |
| BGA Rework Services | BGA reballing, component replacement, pad repair, track repair, site modification, and damaged pad correction. |
| Component Packaging Support | Processes components supplied in cut tape, reel, tube, and tray formats. |
| Stencil Capability | Precision laser-cut stainless steel stencils for accurate solder paste deposition. |
Testimonials
Our high-speed network switch boards use complex dual-sided BGAs with via-in-pad routing. PCBMay’s epoxy-filled and capped via processing eliminated our worries about solder voiding. The thermal profiling was spot on, and the boards have been running perfectly in the field with total reliability.
Simon VanceChief Technology Officer at CloudRoute SystemsWe were struggling to find an assembly partner who could reliably handle our Micro BGAs for a new wearable device. PCBMay delivered the initial batch with absolutely zero bridging or alignment issues. Their X-ray inspection report gave our engineering team full confidence from day one.
Thomas ChenPrincipal Hardware Engineer at NexaWear Technologies
Related Product
An automated manufacturing process where electronic components are soldered directly onto the surface of a PCB, enabling smaller, faster, and more efficient circuit designs.
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Anatomy of BGA Package
A BGA package may look simple from the outside, but it contains several important parts that work together. Understanding these parts can help you better understand how BGA PCB assembly works and why BGA components are widely used in modern electronic devices.
It is consists of three main parts:
- Substrate – A small printed circuit board inside the BGA package. It routes electrical signals from the silicon die to the solder balls underneath. It also provides mechanical support for the entire package. Without the substrate, the chip could not connect properly to the PCB.
- Die – The die is the actual silicon chip that performs the electronic function. It contains millions, or sometimes billions, of tiny transistors that process data and control operations. This is the core of the BGA component and the part that does the real work.
- Solder Balls – Solder balls form an array on the bottom of the BGA package. These small solder spheres create both electrical and mechanical connections to the PCB during BGA assembly. They help transfer signals, power, and heat between the component and the board while securely holding the package in place.
Advantages Of A BGA Assembly
High Interconnection Density
One of the biggest advantages of BGA assembly is its high interconnection density. Solder balls cover the entire underside of the package instead of only the edges. This design allows hundreds or even thousands of I/O connections in a compact area. As a result, you can create more complex circuits without increasing PCB size.
Improved Electrical Performance
BGA packages use shorter electrical paths between the silicon die and the PCB. Shorter signal paths reduce resistance, inductance, and signal loss. This helps signals travel faster and more accurately. For high-speed devices, this can make a noticeable difference in overall performance.
Superior Thermal Performance
Heat is a major concern in modern electronics. BGA packages help by spreading heat through multiple solder balls into the PCB. This creates efficient heat transfer paths and keeps operating temperatures lower. Better thermal performance often leads to better stability and longer component life.
Enhanced Reliability
BGA assembly offers strong and reliable solder joints. During reflow soldering, the package can naturally align itself as the solder melts. The solder joints are also evenly distributed under the package, which helps reduce mechanical stress. These features improve assembly yield and long-term reliability.
Space and Size Efficiency
BGA technology allows you to fit more functionality into a smaller area. The package uses a compact structure with a low profile and minimal external features. This makes BGA components well suited for portable devices, communication equipment, and other space-constrained applications.
Small Footprint
Compared with many traditional packages, BGA components occupy less board space while supporting more connections. Their compact footprint gives designers greater flexibility when laying out the PCB. This is especially important when board space is limited.
Lower Parasitic Inductance and Capacitance
The short connection paths in a BGA package help reduce parasitic inductance and capacitance. Lower parasitic effects improve signal quality and reduce electrical noise. This is one reason why BGA packages are widely used in high-frequency and high-speed circuits.
Avoidance of Wiring Chaos
As pin counts increase, PCB routing becomes more difficult. BGA packaging helps organize connections more efficiently. Power and ground connections can be placed near the center, while signal connections remain around the outer areas. This arrangement simplifies routing and helps prevent crowded or confusing PCB layouts.
BGA Assembly Process Flow
Baking Procedures
Before assembly begins, both the PCB and BGA components may go through a baking process. This step removes absorbed moisture from the materials. Excess moisture can expand rapidly during reflow soldering and cause defects such as delamination or package cracking. Proper baking helps improve assembly reliability and reduces moisture-related failures.
Solder Paste Printing
Solder paste printing is one of the most important steps in BGA assembly. A stencil applies a controlled amount of solder paste onto the PCB pads. The paste must be deposited evenly and accurately. Too much solder can cause bridging, while too little can create weak solder joints. Consistent printing helps ensure reliable connections during reflow.
BGA Component Placement
After solder paste printing, the BGA component is placed onto the PCB using automated pick-and-place equipment. Modern placement machines use vision systems and fiducial marks to achieve high accuracy. Proper alignment is critical because the solder balls must match the PCB pads precisely before soldering begins.
Reflow Soldering
Once the BGA component is placed, the PCB enters a reflow oven. The oven follows a carefully controlled temperature profile that melts the solder paste and creates permanent electrical and mechanical connections. During this process, the solder balls bond with the PCB pads, forming reliable solder joints beneath the BGA package.
Each heating stage has a specific purpose. If the temperature rises too quickly or remains too high for too long, defects such as voids, bridging, or weak solder joints can occur. A properly controlled reflow profile helps maximize solder joint quality and long-term reliability.
Careful control of each zone is critical during BGA assembly. Even minor temperature variations can affect solder joint integrity, especially in fine-pitch BGA packages.
Inspection and Verification
Because BGA solder joints are hidden underneath the component body, standard visual checks aren’t enough. At PCBMay, we solve this challenge by embedding strict inspection and testing checkpoints throughout the entire assembly process to catch hidden flaws.
Our quality checks start before soldering and continue long after the boards leave the reflow oven. We use a combination of automated technology and physical testing to spot hidden defects early, ensure every solder ball connects perfectly, and guarantee your final product works.
| Inspection Method | Purpose |
| Solder Paste Inspection (SPI) | Verifies solder paste volume, position, and print quality before component placement. |
| X-ray Inspection | Examines hidden BGA solder joints after reflow and detects voids, opens, shorts, and bridging defects. |
| Automated Optical Inspection (AOI) | Checks component placement, polarity, and visible soldering defects after assembly. |
| Flying Probe Testing | Verifies electrical connections and helps identify opens or shorts without dedicated test fixtures. |
| In-Circuit Testing (ICT) | Tests individual circuit nodes and electrical connections to confirm proper assembly. |
| Functional Testing | Verifies that the completed PCB operates correctly under normal working conditions. |
No single inspection method can detect every defect. That is why high-reliability BGA PCB assembly often combines SPI, AOI, X-ray inspection, and electrical testing.
Via-in-pad Method for BGA Assembly
PCBMay supports via-in-pad technology for high-density and fine-pitch BGA assembly projects.
For BGA packages with limited routing space, via-in-pad structures help improve signal integrity, simplify routing, and increase wiring density. To prevent solder wicking during assembly, all vias are properly filled, capped, and planarized before surface finishing.
This capability is especially important for advanced HDI PCBs, memory devices, processors, and other fine-pitch BGA applications.
Solder Paste Selection and Control
PCBMay selects solder paste according to component requirements, assembly complexity, and reliability targets. For most BGA assemblies, no-clean solder paste is used to reduce post-process cleaning while maintaining strong and reliable solder joints.
Solder paste storage conditions, printing parameters, and shelf life are carefully controlled to ensure stable soldering performance throughout production.
Cleaning and Functional Testing
Once the soldering is complete, we at PCBMay review your specific cleanliness requirements. If your project demands it, we run the boards through a specialized cleaning system to wash away any remaining flux or microscopic debris.
The finished board goes to PCBMay testing department for strict electrical and functional evaluation. We run the assembly strictly to confirm that every BGA chip communicates flawlessly with the rest of the PCB. This thorough testing is our final gate to make sure your product performs reliably.
Standards for BGA Assembly
Reliable BGA assembly depends on strict industry standards. These standards define requirements for soldering quality, component handling, inspection, and process control. Following them helps ensure reliable solder joints and consistent manufacturing results.
| Standard | Purpose |
| IPC-A-610 | Standard for electronic assembly acceptance criteria. |
| IPC J-STD-001 | Standard for electronic assembly soldering requirements. |
| IPC J-STD-020 | Classifies moisture and reflow sensitivity of components. |
| IPC-7095 | Design and assembly guidelines for BGA components. |
At PCBMay, our BGA assembly processes follow relevant IPC standards to maintain solder joint reliability, process consistency, and product quality throughout production.
BGA Assembly Challenges
Although BGA assembly offers many advantages, it also presents several manufacturing challenges.
Thermal Stress and Warpage
Heat is one of the biggest challenges in BGA assembly. During reflow soldering, the PCB and BGA package expand and contract as temperatures change. Because they often expand at different rates, the board or component can warp. Even slight warpage may prevent some solder balls from making proper contact with their pads.
To reduce this risk, we review the PCB stack-up and copper distribution before production begins. Balanced designs help the board stay flat during reflow. We also develop custom thermal profiles and use dedicated fixtures to support the PCB throughout the heating and cooling process. This helps maintain stable solder connections and improves assembly reliability.
Solder Joint Reliability
BGA solder joints absorb stress every day. Temperature changes, vibration, and mechanical shock all affect the connections beneath the package. Over time, weak joints can crack and lead to intermittent failures or complete circuit failure.
Reliable joints start with good process control. We carefully manage reflow temperatures and soldering time to create strong solder connections. For products used in demanding environments, underfill material can also be added beneath the BGA package. This extra support helps distribute stress and improves long-term durability.
Inspection Complexity
Unlike other components, BGA solder joints cannot be inspected visually after soldering. The component body completely covers the solder balls. As a result, hidden defects may go unnoticed without specialized inspection equipment.
To verify solder joint quality, we check these following possible defects o ensure the quality of BGA assembly joints.
| Defect | Cause | Detection Method | How to Prevent It |
| Voiding | Moisture or trapped flux gases inside the solder joint | X-ray inspection | Control moisture and use a proper soak profile |
| Bridging | Excess solder paste or component misalignment | X-ray, electrical testing | Optimize solder paste printing and placement |
| Head-in-Pillow | Oxidized solder surfaces, package warpage, or insufficient solder paste | X-ray inspection | Use fresh solder paste and control reflow conditions |
| Open Joints | Insufficient solder paste or poor solder wetting | X-ray, ICT, functional testing | Monitor solder paste volume with SPI |
| Misalignment | Pick-and-place errors or incorrect fiducial recognition | AOI, X-ray inspection | Regularly calibrate pick-and-place machines |
Rework Difficulty
BGA rework requires specialized equipment and trained technicians. Since the solder joints are hidden beneath the component, standard soldering tools cannot access them safely.
For defective parts, dedicated BGA rework stations are used to apply controlled heat directly to the target component. This allows the package to be removed and replaced without damaging nearby parts or PCB pads.
Component Handling
BGA components require careful storage and handling before assembly. Moisture exposure, contamination, or physical damage can affect solderability and lead to assembly defects.
To protect component quality, all parts are handled in an ESD-safe environment with controlled humidity levels. Moisture-sensitive devices are stored according to their MSL requirements. When necessary, components are baked before assembly to remove absorbed moisture and prevent reflow-related damage.
PCBMay BGA Assembly Services
PCBMay provides turnkey BGA PCB assembly services for prototype, low-volume, and mass production projects. Our capabilities include fine-pitch BGA placement, high-density PCB fabrication, traceable component sourcing, and advanced X-ray inspection under one quality-controlled process. Backed by advanced X-ray inspection and controlled thermal reflow equipment, we help minimize assembly defects and ensure consistent build quality.
Send your Gerber and BOM/DFA files to us for an engineering review and immediate quote.
PCBMay supports BGA pitches as small as 0.25 mm, including 100% X-ray inspection for all BGA solder joints. For finer pitch BGA likes 0.20mm, contact us directly.
Key factors include fine-pitch BGAs, X-ray inspection, rework needs, testing, and assembly volume.
No. Rework depends on the board design, component value, and damage risk.
We use X-ray inspection, process control, and functional testing to verify solder joint quality.
Please provide Gerber files, BOM, Pick-and-Place files, and assembly drawings.
Yes. We support both prototype builds and high-volume production.
Yes. We recommend and support ENIG surface finishes for BGA pads to ensure reliable soldering and strong solder joint performance.
Yes. X-ray inspection is available to inspect hidden solder connections under BGA packages.
Yes. We offer functional testing, ICT, and other test services based on project requirements.
Yes. We can assemble BGAs alongside SMT, THT, and mixed-technology components.
Usually we can provide your BGA assembly PCBs within 3–4 days for assembly once all components are received, Final turnaround time depends on board complexity, component availability, and order quantity.