Notable Direct Bonded Copper Manufacturer in China

Leading Provider of Direct Bonded Copper and PCBs

Our reputation as a PCB provider determines our responsibilities to you. Because the quality of your products is so important, you need to work with a reliable firm like PCBMay. With us, you can obtain Direct Bonded Copper of excellent quality.

• We improve our PCB manufacturing process on a regular basis.
• We ensure that all of your PCB designs are executed flawlessly.
• We have the ability to mass-produce electrical components.
• We give IT support and full customer service coverage.
• Make your end device the most valuable it can be.

That is why you can count on PCBMay as your business partner.

Advanced PCB fabrication technologies are used to create our quality Direct Bonded Copper products. We keep a close eye on Quality Control and Environmental Management Systems since we follow ISO 9000 and ISO 1400 standards.

Our company’s mission statement includes taking care of you as a customer to ensure your satisfaction. Furthermore, we adhere to the safest Direct Bonded Copper and PCB manufacturing processes.

Our sales representatives are available 24 hours a day, 7 days a week, and are extremely educated about all our product offerings, may it be Multilayer PCB, HDI PCB, or any other Copper Clad PCB products.

PCBMay is convinced that you will be satisfied with our Direct Bonded Copper and PCB products, as well as PCB-related services. You will be a return customer once you have purchased from us. We’re so good that we guarantee your satisfaction with all of our products.

Call to inquire and order now!

Direct Bonded Copper: The Ultimate FAQ Guide

Are you worried about the electrical properties of your high-power printed circuit boards?

Using direct bonded copper is a reliable way to maintain electronic isolation in high-power electronic devices. Besides, this PCB ensures excellent thermal management in different circuit boards.

Do you know the ins and outs of its manufacturing? PCBMay, based in China, is a dependable PCB manufacturer that ensures the proper use of direct bonded copper in PCBs.

This FAQ guide will let you know the details of this technology in simple language. We hope you will benefit from this through explanations. Let’s start.

What Is Direct Bonded Copper Technology In PCB Manufacturing?

Direct bonded copper (DBC) is a reliable technology to upgrade the thermal efficiency of PCBs. This technology is widely used in power electronics. Usually, the directly bonded copper substrate ensures high thermal conduction.

Direct bond copper is applied with Alumina (Aluminium Oxide) and Aluminium Nitride. That’s why a pure copper substrate offers premium current carrying capacity and thermal dissipation on ceramic.

Here, the impurity-free copper creates direct bonds with Aluminium-based compounds. This process involves diffusion and melting at a high temperature. The thermal conduction and coefficient of thermal expansion (CTE) make the ceramic substrate of DBC in high-power electronics.

Again, DBC does not quickly wear out during the operation of high-current PCBs. That’s why it is ideal for durable packaging in coverless dice. In a nutshell, this technology promotes PCB manufacturing quality to a large extent.

Direct Bonded Copper Technology

Different types of directly bonded copper are used in PCB applications. Such as-

• Direct bonded copper ceramic PCB
• Direct bonded copper multilayer PCB
• Direct bonded Alumina copper PCB
• Metalized direct bonded copper PCB
• Direct bonded gold-coated copper PCB.

All of these types are worthwhile for robust electronic products. Check this video to get a better understanding of this technology:

How Is DBC Made?

DBC (Direct Bonded Copper) involves mating two highly conductive materials, copper and ceramic. These materials are electrically different, but their interfaces are reliable for PCB.

The copper-Oxygen eutectic process is an essential part of the making of DBC. This eutectic is an amalgamation of cuprous oxide and liquid copper. It forms on the copper surface at almost 1065⁰C.

Cuprous Oxide and Alumina combine and produce copper aluminates, having a low concentration. In this case, the melting point needs to be lower than the copper substrate and ceramic.

When this compound gets cooled, the cuprous oxide makes a strong bond with Alumina, copper aluminates, and pure copper.

This eutectic gets wet at the melting temperature and creates a direct bond between these copper and ceramic. The interfacial layer plays a significant role in bonding Alumina with pure copper.

Direct Bonded Copper Processing

What Are The Features Of PCB Direct Bonded Copper?

Direct bonded copper PCB offers outstanding features that significantly promote the product’s quality. But are you aware of its specifications?

Let’s have a look.

• High thermal conductivity of Alumina (24 W/mK) and Aluminium Nitride (180/230 W/mK).
• Excellent thermal spread.
• High isolation potential.
• Low coefficient of thermal expansion of Alumina (7.1 ppm/K) and Aluminium Nitride (4.7 ppm/K).
• High-temperature resistance.
• Surface mount soldering
• Compatible with Gold wire and ribbon bonding.
• High glass transition temperature.
• Lead-free compatible to a certain extent.
• Low dielectric constant.
• High decomposition temperature
• High copper thickness (around 200-600 micrometers).

Direct Bonded Copper Features

What Are The Applications Of Direct Bonded Copper?

Direct bonded copper has multiple applications in different electronic devices. Modern electronic applications demand hassle-free thermal management, along with smooth electronic features.

Direct bonding in copper and ceramic substrates fulfills these requirements with outstanding reliability. That’s why this technology has significant uses in analog and digital electronics. Its most prominent applications include-

• High power devices
• Aerospace instrument
• Military equipment
• Integrated chip
• Solar panel assembly
• Laser electronics
• Semiconductor refrigerator
• Smart power modules
• Multi-chip
• Electronic heating equipment
• Cooling mechanisms
• Communication devices
• Navigation instrument
• Transistors
• Transformers
• Power hybrid circuits
• Solid-state relays
• Gaming devices
• Home appliances

This technology is very common in ceramic PCB and high TG circuit boards. Its superb performance in the case of temperature control improves its usability in versatile sectors. You should consult a dependable and high-class PCB supplier to get the optimum output of DBC direct bonded copper.

Widely Used Direct Bonded Copper

What Is The Ideal Master Card Format Of PCB Direct Bonded Copper?

The most appropriate size of direct bonded copper Mastercard is 7.5″-5.5″. It is ideal for placing multiple master cards in a single panel. This master card contains Alumina, Silicon Nitride, Aluminium Nitride, etc.

DBC supports the production equipment and materials required for handling this master card size. Besides, it is effective to maintain the process chain that covers initial and final testing.

The copper sheets of DBC are a little bit smaller. You can easily place these sheets to maintain the 7.5″-5.5″ dimension of the master card in a unit.

How Does Coefficient Of Thermal Expansion Affect Direct Bonded Copper?

The CTE (Coefficient of Thermal Expansion)  is a vital feature of direct bonded copper PCB. It indicates the expansion of the PCB materials due to the unit increase of temperature. That means this is a reliable indicator of the thermal performance of direct bonded copper in printed circuit boards.

Usually, a low CTE is important for having outstanding thermal behavior from the circuit boards. In the case of DBC, the CTE values are worthwhile for high-frequency and high-power PCBs.

You can find the CTE value of 7.1 ppm/K and 4.7ppm/K for Aluminium Oxide and Aluminium Nitride, respectively. These values are very close to the CTE of silicon, which is reputable for its robust nature.

That means you can use the direct bonded copper in packaging cover-free dice properly. Besides, it ensures high robustness during its shelf life.

That’s why this technology is more applicable in printed circuit board design compared to other technologies. Again, a low coefficient of thermal expansion allows the designer to customize the circuit board design by maintaining thermal properties. So, CTE has significant importance in DBC used in PCB assembly.

Direct Bonded Copper With Low CTE

What Are The Benefits Of Direct Bonded Copper In PCB Manufacturing?

Direct bonded copper provides immense advantages in PCB manufacturing. It helps upgrade the design stability and technical aspects of electronic appliances. Its significant advantages are described below for your convenience.

Improved Metalization Adhesion

Direct bonded copper processes improve the metallic adhesion in PCB-based applications. It ensures the incorporation of pure copper in ceramic substrates. The metalization adhesion is highly effective during the operation of devices.

Mechanical Stability

Every user looks for a mechanically stable circuit board. But it is not so easy to achieve this feature in electronic gadgets. So, what should you do?

You just need to apply DBC technology in PCB designs. Then, it handles the rest with superior functionality. It improves the mechanical features to a large extent.

The construction materials of directly bonded copper ensure stability in the case of mechanical features. That’s why it remains operative at a high vibration and other mechanical stresses.

Electrical Isolation

Maintaining isolation during the component placement on the PCB surface is mandatory. Otherwise, it will be a great hassle to achieve the best result.

Direct bonded copper acts to isolate the components electronically. Thus, it improves the electrical features needed to promote the projects.

High Thermal Conduction

Pure copper and ceramic materials are reputable for reliable thermal conduction. DBC consists of Alumina and AlN (Aluminium Nitride). Both of these compounds have sufficient thermal conductivity.

High Current Conduction

Direct bond copper is supportive of heavy coppers. Usually, high copper thickness is adequate for carrying higher current loads. That’s why you can improve the current conduction of your electronic applications by using DBC technology.

Besides, proper use of Aluminium and copper metals in PCB surfaces promotes current-carrying speed to a large extent. Both of these metals are good conductors.

They can handle overloads, overcurrents, short circuits in high-current PCB efficiently. So, it is easy to optimize your circuit board in high-current applications.

Effective Thermal Resistance

Thermal resistance is a crucial property in electronic components that deal with extreme temperature and current loads. DBC direct bonded copper offers an effective thermal resistance in PCB due to having copper, aluminum, and ceramic substrates.

It makes the circuit board compatible with a wide temperature range (more than 180⁰C). But it never compromises with reliability and product quality while dealing with thermal stresses.

Reliable Thermal Drain

DBC technology is a practical way to dissipate excessive heat from the PCB surface. It can keep the lower portion of PCB components cool enough to function at high temperatures.

Besides, directly bonded coppers help use thermal vias in PCB designs. That’s why it can manage thermal drainage properly in advanced electronic devices that always handle high current loads.

High Functionality

Direct bonded copper (DBC) substrates produce a higher surface area in printed circuit boards than other technologies. That’s why it can enable the device for a liquid cooling mechanism.

Moreover, its operation is very reliable and durable. You can improve the service life of an electronic appliance by properly using the directly bonded copper in the circuit board.

Durability

Durability is a great concern for temperature-sensitive components used in power electronics. Direct bond copper ensures sufficient tolerance of PCB components against extreme thermal stress and vibration.

Again, it supports the implementation of conformal coatings on the PCB surface. These metallic coatings keep the circuit free from dust and moisture to a great extent.

Cost Efficiency

Direct bond copper substrate offers cost-effective services in PCB applications. Its incorporation and maintenance require an affordable cost. So, you can boost your business to the next level and make sufficient profit by applying the DBC process.

Ecological Effectiveness

Environmental efficiency is another significant advantage of PCB having directly bonded coppers. This technology supports lead-free mechanisms. That means it is effective for ensuring green electronics.

Besides, there is no significant use of harmful materials. So, you don’t need to be worried about health issues while dealing with DBC.

Benefits Of Direct Bonded Copper In PCB

What Are The Differences Between Direct Bonded Copper And Metal Core PCB?

The major differences between DBC and metal core PCB include-

Metal Core PCB Structure

How Do You Optimise The Master Card Surface Area Of Direct Bonded Copper?

The master card surface can hold various DBC substrates. The number of substrates varies due to their shape and size. Improper placement of substrates causes problems for DBC while using it in circuit boards.

The very short surface area with small substrates requires a lot of time for laser scribing.  These DBC substrates also increase the production cost.

On the other hand, large substrates require high quality despite being easy to handle. You can’t afford to apply substandard DBC substrates for your PCB.

You can optimize the master card surface by considering the following rules-

• Use not more than 100 rectangular substrates for a single Mastercard.
• The width ratio length needs to be less than 2.
• Properly bend the substrates by considering their shapes, sizes, placement, width radio, etc.

Direct Bonded Copper Surface Optimization

What Are The Specification Comparison Between DBC And AMB Substrates?

DBC and AMB (Active Metal Brazing) substrates are worthwhile for the attachment of thick layers of metal with ceramics. But these two have considerable differences in the case of specifications.

AMB involves soldering metallic foil to the ceramic substrate by using solder paste. Here,  the operating temperatures vary from 800-1000°C.

The main difference between AMB and DBC is the volume of PCB productions. Unlike DBC, AMB is applicable in a vacuum. That’s why you can’t apply this technology for high-volume PCB manufacturing.

Watch this video to know more about their difference:

What Are The Thermal Process Requirements For PCB Direct Bonded Copper?

The required thermal processes for effective direct copper are-

• The attachment atmosphere should not contain more than 5 ppm Oxygen. It ensures a useful copper surface.
• A controlled oxidation atmosphere is mandatory.
• A precisely controlled cooling mechanism for ceramic
• Temperature variation should be 2°C along with soaking. It ensures a controlled flow of eutectic.
• Thermal control to achieve uniformity.

DBC Thermal Process

How To Increase The Bonding Strength Of Direct Bonded Copper?

You can improve the bonding strength of DBC if you improvise the process. But how?

You need to oxidize 96% Alumina-ceramic substrate through Cuprous Oxide. Then, heat the substrates up to 1150°C in the air.

After that, increase the temperature up to 1070°C in pure Nitrogen. It is necessary to make bondage between the copper foil and substrate. Then, an interface of Copper Aluminate is formed that increases the bonding strength to a large extent.

Bond Strength Development In Direct Bonded Copper

What Are The Design Rules For PCB Direct Bonded Copper?

The basic design rules for PCB direct bonded copper are-

• Keep the Mastercard size within 7.5″-5.5″.
• Don’t use more than 100 substrates in a single Mastercard.
• Maintain the necessary copper thickness(18um-70um).
• Create a copper Aluminate interface between the copper foil and ceramic substrate.
• Place thermal vias concerning the size of the DBC unit.

You can use design software to maintain precision in the DBC design process. We offer high-class designs for DBC in circuit board manufacturing. Inquire us immediately to get the best service.

DBC Design Rules

How Do You Compare Between DBC And LTCC?

DBC and LTCC (Low-Temperature Co-fired Ceramic) are two effective technologies used in power electronics. We are here with a comparative analysis between these two processes so that you can make a good choice.

Low-Temperature Co-fired Ceramic Substrate

What Are Different Shapes And Delivery Options Of Direct Bonded Copper?

Direct bonded copper comes with different shapes and delivery options. The most suitable shape is rectangular due to its low expense.

Rectangular DBC ensures easy placement of substrates without causing any lateral gap between two consecutive substrates. Besides, the laser scribing process is convenient in rectangular shapes of DBC. You can deliver this DBC with or without pre-cutting in the master card format.

Other shapes, like ellipses, circles, etc don’t ensure high quality. But, these shapes require laser cutting instead of laser scribing.  That’s why the production time increases to a certain extent. Again, they only support the delivery of substrates as a single unit.

Moreover, you can optimize high-volume DBC with rectangular shapes. So, rectangular DBC substrates are worthwhile for large-scale PCB projects.

Direct Bonded Copper Delivery Options

What Are The Challenges Of Using Direct Bonded Copper In PCB?

Though DBC is an effective technique to improve the thermal performance of PCBs, its implementation is complicated. You need to overcome some challenges to get the desired output from this process.

The most notable challenging issues are-

• Its design requires optimum precision.  If you don’t mix the materials properly, the bonding malfunctions.
• Optimization of Mastercard surface area.
• Handling the temperature change is crucial in this case. You must keep the melting temperature lower than the thermal state of pure copper and ceramic.
• Maintaining the concentration of copper-alumina amalgam is also a challenging task.
• Designing a multilayer stackup with direct bonded copper demands high attention due to handling different CTE, DK at each layer.

Challenges In Direct Bonded Copper Design

How To Test Direct Bonded Copper In PCB?

Direct bonded copper substrate is a technical issue for the PCB manufacturing process. It requires high precision to achieve the optimum output from a PCB  dimensional feature. This is also the same for the DBC process.

That’s why you need to test the DBC- enforced circuit boards to maintain their quality. Automated tests provide more reliable output compared to manual testing in this case.

There are two effective automatic inspections for direct bonded copper PCBs. They are-

Automated Optical Inspection (AOI)

The AOI test is useful to check the faults in mating copper materials with ceramic substrates. Here, An AOI machine, consisting of a high-resolution camera, takes 2D and 3D images from different angles.

Then, the inspector makes a comparative analysis between these photographs and the images of ideal coppers. Thus, you can detect the faults of your PCB designs.

This test delivers results within a short time but maintains high accuracy. You can consider the AOI test for high-volume PCB manufacturing with direct bond coppers. It detects dimensional faults, improper solder joints, etc.

Automated X-ray Inspection (AXI)

It is another trusted inspection of direct bonded gold plated copper PCBs. Here, a highly penitentiary X-ray is used to detect defective placement of copper, Alumina, ceramic substrates, etc. It enables you to check critical portions of the PCB having a DBC process. You can not usually check those parts by applying traditional tests.

DBC Inspection During PCB Manufacturing

Automated tests take a very short time, but these are expensive compared to manual tests. So, you need to make a decision concerning the volume of PCB production and your budget. An experienced PCB maker can handle this issue without making any hassle.

What Are The Must-Have Features Of A Direct Bonded Copper Manufacturer?

Direct bonded copper includes a new dimension to circuit board manufacturing. If you can manage to have a reliable PCB manufacturer that has expertise in DBC processes, it can improve the product quality. But how do you choose a dependable PCB maker in this competitive market?

Don’t worry. We are here to relieve you from this tension. You must search for some crucial specifications in the PCB manufacturer. We have listed some must-have features of a trustworthy and knowledgeable DBC manufacturer in China.

• Regular improvement of PCB manufacturing process.
• Long experience in DBC processes in high-power and high-density PCB.
• Flawless execution of PCB designs.
• Affordable manufacturing costs.
• The ability to handle mass production of electronic devices consisting of directly bonded copper.
• Skilled and RoHS-certified engineers and technical staff.
• Sufficient equipment service.
• The capability of delivering custom solutions as per the client’s demand.
• Smart IT service.
• Full coverage of customer service.

We have been engaging in DBC enforcement in PCB applications for around 15 years. Our production team consists of high-level experts. So, you can undoubtedly rely on us to upgrade your device’s performance.

Conclusion

Direct bonded copper has extensive use in various electronic applications due to its worthwhile features. You can improve the quality of your devices by incorporating bonded copper.

PCBMay offers versatile direct bonded copper PCBs with stable designs, which can boost your business. We tried to explain all details so that you can get a deep understanding of its production and incorporation.

So, Contact us to get the best product that suits your budget.