Advantages of PCB Varnishing and Types of Coatings

arnishing of printed circuit boards is necessary to protect their surface from adverse environmental influences: dust and moisture, which are constantly present in the air. Moisture absorbed into the material impairs its dielectric properties and causes corrosion.

The outer layer of the printed circuit board renders without electrical insulation, this can disrupt the operation of equipment and apparatus.

The application of a protective coating – varnishing will help to solve the arising problems.

After installation and thorough rinsing, a varnish is applied to the printed circuit board, which ensures its normal operation even in adverse external conditions: for example, when the temperature and humidity conditions change.

Types of Varnishing of Printed Circuit Boards

Acrylic varnish, which forms an elastic film with a visible shine, resistant to chemically aggressive media, including salts and acids, as well as thermal and mechanical influences, works in a wide temperature range.

Soldering can be done through a layer of varnish.

A polyurethane-based varnish that protects the board with a durable film that is non-conductive and resistant to chemically aggressive environments. The varnish film has good adhesion to the board material.

The varnishing of printed circuit boards, which is offered by Telerem, is the most demanded and quickly implemented way of protecting them.

Process Compatibility with Existing PCB Technology

Comparing the technological operations of the production of printed circuit boards of the design and standard technologies showed that most of the equipment used in the manufacture of printed circuit boards traditionally can be used directly during the transition to new technology, including special equipment for double-sided exposure, applying a protective layer, pressing; galvanic installations, drilling equipment. Therefore, switching to new technology will not require significant costs.

The production of PCBs of grade 5 and above, as well as the production of large hybrid integrated circuits, will require cleanrooms for photolithography operations.

The economic efficiency of this technological process is illustrated by the calculation of the conditional annual profit, carried out by the difference in the cost of traditional and new products, without taking into account other components (overhead, trade costs, etc.).

Moreover, when using traditional technology, 8 tons of copper are transferred into the solution per year, 30 kg of palladium are used, a large amount of chemicals is consumed.

At the moment, the developers of the new technology are looking for business partners willing to invest in the production of serial printed circuit boards for new generation radio-electronic equipment.

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