PCBMay Provides Different Types of PCB Stackup for You
Stackup is an Important Part of the PCB Design and Manufacturing Process. A Good Stack-up Design is Key to Reduce Electromagnetic Emission (EM) from Electronic Circuitry.
What is PCB Stack-up
PCB Stack-up refers to the arrangement of copper layers and insulating layers that make up a PCB prior to board layout design.While a layer stack-up allows you to get more circuitry on a single board through the various PCB board layers,the structure of PCB stack-up design confers many other advantages:
- A PCB layer stack can help you minimize your circuit’s vulnerability to external noise as well as minimize radiation and reduce impedance and crosstalk concerns on high-speed PCB layouts.
- A good layer PCB stack-up can also help you balance your need for low-cost,efficient manufacturing methods with concerns about signal integrity issues.
- The right PCB layer stack can enhance the Electromagnetic Compatibility of your design as well.
The simple stack up is 2layer,please see the stack up as below:
It will very often be to your benefit to pursue a stacked PCB configuration for your printed circuit board-based applications.
For multilayer PCBs,general layers include ground plane (GND plane),power plane (PWR plane),and inner signal layers.
PCBMay’s Standard PCB Layer Stack-up
PCBMay manufactures multilayer circuit boards with layers in the range from 4 to 40 layers,board thickness from 0.4mm to 4.0mm,copper thickness from 1oz to 8oz,inner layer copper thickness from 1oz to 4oz,and minimal spacing between layers to 3mil.
Following images present PCBMay’s default layers stack-up of PCB service.If you don’t require customized PCB layer stackup,we will make the multilayer PCBs according to our default layers stackup as below:
This is the stack up for standard 4layer,normally there’re 4 Copper foil’s,1 Core and 2 Prepreg’s:
This is the stack up for standard 6layer,there’re 6 Copper foil’s,2 Core and 3 Prepreg’s:
This is the stack up for standard 8layer,normally there’re 8 Copper foil’s,3 Core and 4 Prepreg’s:
This is the stack up for standard 10layer,normally there’re 10 Copper foil’s,4 Core and 5 Prepreg’s:
This is the stack up for standard 12layer,normally there’re 12 Copper foil’s,5 Core and 7 Prepreg’s:
Why Need Stack-up
Before designing a multi-layer PCB, designers need to firstly determine the circuit board structure according to the size of the circuit,circuit board size and EMC requirements. That is, decide whether to use a 4layer or 6layer or 8layer or more circuit board. After determining the number of layers, determine the location of the inner layers and how to distribute different signals on these layers.
Planning a multi-layer PCB stack-up configuration is one of the most important aspects to achieve optimal product performance. Improperly designed substrates and improperly selected materials will reduce the electrical performance of signal transmission, thereby increasing emission and crosstalk, and making products more susceptible to external noise. These problems may cause intermittent operation due to timing failures and interference, which greatly reduces product performance and long-term reliability. On the contrary, a correctly constructed PCB substrate can effectively reduce electromagnetic radiation, crosstalk and improve signal integrity, thereby providing a low-inductance power distribution network. And, from a manufacturing point of view, the manufacturability of products can also be improved.
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