Your Custom Power PCB Manufacturer in China Over 12 Years

Why Choose PCBMay for Your Power PCB Projects

As an experienced power PCB manufacturer in China, we could make the copper thickness will be reached to be 12oz of power PCB.

From single-sided layer to multilayer PCB, from the rigid printed circuit board, flexible PCB to rigid-flex PCB, power PCB is used mixed with them.

As an ISO and UL certificated factory, PCBMay strictly controls the quality of products and provides customers’ high-quality power PCBs.

We also make sure to deliver the product within the scheduled delivery time. PCBMay assures the perfect product to our customers since we use our latest machinery equipment.

Power PCB

If you are looking for a power PCB for your project, PCBMay assures you the best, high-quality product and offers you excellent services.

At PCBMay, customer satisfaction is our goal. As long as you have the request, please let us know it, we will do our best to match it.

Please send your quote to us right now, we will offer the quotation immediately.

Power PCB: The Ultimate FAQ Guide

In the past, forming a power and ground plane with a four-layer board solved most of the power integrity problems.

In addition, in order to avoid small power supply problems on the power PCB, it was also effective to insert a decoupling capacitor between the power supply and ground for each IC in addition to the power supply plane.

However, in recent years, not only the cost and development schedules of PCBs but also area requirements have become stricter.

And it is difficult to solve problems using only conventional methods.

As a result, designing a power distribution circuit built into a PCB has become a daunting task.

What is Power PCB

The Power PCB is the backbone of all modern electronics. This detail is in every device.

Smartphones, keyboards, and mice, laptops, and computers – each of these devices contain one or more printed circuit boards.

Power PCB

General Thickness of Power PCB

While the circuit thickness of a general printed circuit board is 35 μm, a circuit with thick copper up to 2000 μm has been realized, making it possible to handle large currents.

For circuits with a large electrical load such as high voltage and high current, the width of the wiring can be made narrower by making the wiring thicker in the vertical direction.

It is very effective for downsizing the device.

Furthermore, when a thick copper circuit is used for the surface layer. The stability of surface mount components is improved due to the wide top dimension.

Similarly, half of the circuit is buried in the resin. Solder flow can be suppressed and solder mounting reliability is also improved.

This has also led to an improvement in the yield rate in terms of Power PCB board manufacturing.

It can reduce the risk of air bubbles entering the insulating protective film (green resist) and the difficulty of silk character printing.

In addition, it is necessary to pour resin paste between circuits to form thick copper circuits by metal cutting of other companies.

But since the construction method is realized by prepreg and vacuum lamination press, which are general methods for multi-layer boards, there is also a risk of failure. Since it can be reduced and no special equipment is required.

Thick copper high-current Power PCB board does not require circuit joints because it is not a circuit formed by metal cutting.

And it does not require a process to break the joints after stacking. Since the pattern wiring is made as it is with thick copper to realize a natural circuit formation, it is possible to support a high-electricity design with a higher degree of freedom.

A printed circuit board is a plate made of a dielectric on which at least one electrically conductive circuit is formed (usually by a printed method).

A printed circuit board (PCB) is designed for the electrical and mechanical connection of various electronic components or the connection of individual electronic components.

Electronic components on the PCB are connected by their terminals with the elements of the conductive pattern, as a result of which the electronic module (or mounted printed circuit board) is assembled.

You will see more details about power PCBs:

What are Types of Power PCBs

1) Single-Sided Power PCBs.

Boards on a flat layered dielectric;

Boards on embossed cast dielectric;

Boards without hole plating;

Boards with holes plated. These boards are more reliable in operation because better adhesion of the mounted IC and ERE with printed conductors and with the mainboard is provided.

2) Double Sided Power PCBs

Dielectric boards;

Boards on a metal substrate. They are used when it is necessary to provide heat removal when placing heat-generating ERE, semiconductor devices and ICs of a higher power on the board.

3) Multilayer Power PCBs

Multilayer printed circuit boards are boards that are composed of alternating layers of insulating material and a conductive pattern. The drawing is interconnected with spacers into a monolithic structure by pressing.

Laminated boards;

Boards on a ceramic base. These power PCB boards are screen printed with conductors.

At a temperature of about 700 ^o, conductors and resistors are burned into the base, previously fired at a temperature of 1600 ^o.

Multilayer Power PCB

The result is a strong, ceramic, chemically inert monolithic structure with stable parameters and relatively high thermal conductivity;

• Boards without interlayer connections;
• Boards with interlayer connections

4) Flexible Power PCBs.

Flexible boards are used in structures where they are subjected to constant or intermittent bending stress.

Therefore, one of the most important characteristics of flexible printed circuit boards is the high resistance of dielectric materials to mechanical stress, i.e., to the separation of printed conductors from the base. Flexible loops and cables.

How do We Characterize Ceramic Materials in Power PCB?

Ceramic materials are characterized by high mechanical strength, which changes slightly in the temperature range 20-700^o, stability of electrical and geometric parameters, low (up to 0.2%) water absorption, and gas evolution when heated in a vacuum.

Disadvantages of ceramic materials: they are fragile and have a high cost.

PCB manufacturing methods are divided into three groups: subtractive, additive, and sequential build-up.

With subtractive methods, a conductive pattern is formed by removing the foil from unprotected areas of the surface.

To do this, a diagram of the circuit is applied to the foil dielectric, and the unprotected sections of the foil are etched away.

What are the Disadvantages of Subtractive Chemical Method?

The disadvantages of the subtractive chemical method include significant copper consumption and the presence of lateral undercutting of printed conductor elements, which reduces the adhesion of the foil to the base.

This drawback is devoid of the additive method of manufacturing PP, based on the selective deposition of chemical copper on a non-foil dielectric.

In this case, a dielectric is used with a catalyst introduced into its composition and an adhesive layer on the surface.

PCBs manufactured by the additive method have a high resolution (conductors up to 0.1 mm wide), production costs of such boards are reduced by 30% compared to subtractive methods, copper, etching chemicals are saved and the environmental situation in enterprises is improved.

With the semi-additive, or chemical-galvanic method on a dielectric base, a continuous conductive layer is obtained by chemical deposition and then strengthened to the required thickness at the locations of the printed conductors and contact pads by the electrochemical method.

In this case, the best adhesion of the PP pattern to the dielectric is achieved.

The sequential build-up method is used to form a multilayer structure on a ceramic board, consisting of alternating insulating and conducting layers.

In the insulating layers in the places where the interlayer transitions are created, windows are made through which, when the next conductive layer is applied, an electrical interlayer connection is formed.

Thus, the production of power PCB is a laborious and costly process.

The choice of production methods, materials must be selected specifically for each type of product, taking into account the requirements of GOSTs and the conditions of production and operation.

Power PCB

The Power Supply System in the High-speed Circuit System

The power supply system in the high-speed circuit system can usually be divided into three physical subsystems: chip, integrated circuit packaging structure, and PCB.

The power grid on the chip is composed of several metal layers alternately placed. Each metal layer is composed of thin metal strips in the X or Y direction to form a power or ground grid. Via holes connect the thin metal strips of different layers.

For some high-performance chips, a lot of decoupling units are integrated regardless of the core or IO power supply.

The integrated circuit packaging structure, like a reduced PCB, has several layers of power or ground planes with complex shapes.

On the upper surface of the package structure, there is usually a place to install the decoupling capacitor.

Power PCB usually contains a large continuous area power and ground plane, as well as some large and small discrete decoupling capacitor components, and a power rectifier module (VRM).

Bonding wires, C4 bumps, and solder balls connect the chip, package, and PCB together.

The entire power supply system must ensure that each integrated circuit device provides a stable voltage within the normal range.

However, switching currents and parasitic high-frequency effects in power supply systems always introduce voltage noise.

AC Power Supply Ground Impedance Analysis

Many people know that a pair of metal plates constitutes a plate capacitor, so they think that the characteristic of the power supply plate layer is to provide plate capacitance to ensure the stability of the supply voltage.

When the frequency is low and the signal wavelength is much larger than the size of the panel, the power board layer and the floor do indeed form a capacitor.

However, when the power PCB frequency increases, the characteristics of the power supply board layers begin to become complicated.

More precisely, a pair of flat plates forms a flat plate transmission line system.

The noise between the power supply and the ground, or the corresponding electromagnetic field, propagates between the boards according to the transmission line principle.

Power PCB

When the noise signal propagates to the edge of the plate, part of the high-frequency energy will be radiated, but a larger part of the energy will be reflected back.

Multiple reflections from different boundaries of the plate constitute a resonance phenomenon in the PCB.

Why Decoupling is Effective in Power PCB?

In-chip decoupling is very effective, but the price is to use valuable space in the chip and consume more leakage current.

Moving the decoupling capacitors in the chip to the package structure may be a good compromise, but it requires the designer to have knowledge of the entire system from the chip, the package structure to the PCB.

But usually, PCB designers cannot obtain the design data of the chip and package structure and the corresponding simulation software package.

For integrated circuit designers, usually do not care about the lower-end packaging and circuit board design.

However, it is obvious that using the concept of power PCB collaborative design to optimize the analysis and design of the power supply system of the entire system, the chip-package-circuit board is the future development trend. Some companies that are at the forefront of electronic design have actually done so.

Important Instructions for Manufacturing Power PCB

Please also pay attention to the effect of reducing the board size by making the pattern width narrower. Our high-current circuit board is more expensive than generally printed circuit boards, but the circuit board itself can be made smaller, so we also have an element of cost reduction.

The Power PCB is an important part of an electronic product. The design of the linear DC power supply circuit directly affects the performance of the product. Power PCB of our electronic products mainly includes linear DC power supplies and high-frequency switching power supplies.

In theory, the linear DC power supply is how much current the user needs. How much current the input end must provide? The switching power supply is how much power the user needs, how much power the input end provides.

Power PCB Ideal for Mounting power Devices

Power PCB is ideal for downsizing devices with large electrical loads. Such as:

• Large current control circuits for electric vehicles
• Hybrid vehicles
• Robots
• High-power power supplies
• Switching, motor circuits, breakers, fuse boxes, etc.

Power PCB is effective in all these fields.

Compared with screwed copper plate wiring such as bus bar (BUS-BAR), in terms of production, it is possible to consider assembly cost reduction and stable production plan by responding to the printed circuit board production line.

Nowadays, the updating speed of electronic products is extremely fast. It is simply overwhelming.

Power PCB design engineers are more inclined to choose AC/DC adapters that are easily available in the market.

And install multiple sets of DC power supplies directly on the PCB of the system.

Since the electromagnetic interference generated by the switching power supply will affect the normal operation of its electronic products.

The correct power supply PCB layout becomes very important.