SMT Capability

SMT Capability, an Ideal Leading PCB Manufacturing Technology
Leading PCBA Assembly Capacity manufacturing in China. Specializes in PCB Fabrication, Layout, PCB Assembly Service at

PCB is a very thin board that electronic designers make by using, composite epoxy, fiberglass, and some other laminated material.

It is serving not only in industries but also in domestic appliances.

Basically, SMT capability provides the creation of custom electronic circuits by inserting individual components into a PCB.

Moreover, at first SMT technology had appeared in 1980. And now it has become an essential part of all electronic manufacturing procedures.

Companies from all over the world are preferring SMT over all other technologies.

As it has the capability to size down and allows to use of smaller components on the PCB boards.

What is SMT and  SMT Capability

SMT stands for Surface Mount Technology. It is a process to produce electronic circuits.

Moreover, in SMT capability the components are placed or mounted directly on the surface of PCB boards.

So, an electronic device that manufacturers make by using the SMT technique is also famous as SMD (Surface-mount device).

Today all industries have replaced the construction method of the through-hole technology with this advanced and latest technology of SMT.

It is also famous with some other names like:

In this process, electronic designers add components or parts on the PCB boards.

Furthermore, there are two methods to add components to the printed circuit boards. These are:

  • Adding components with the help of machine
  • Adding components with the help of hands

In fact, both methods have their own advantages.

And their results are best whether you add components by a machine or by human hands.

Additionally, when you use these PCB boards in your product it will give you the best results.

Because the current will flow more effectively and smoothly through the surface of PCB boards.

Basically, SMT capability is the most advanced way to arrange the small components on the surface of PCB boards.

Moreover, engineers and electricians are preferring this technology as they have got rid of extra wires or leads which they use to fit components on PCB boards via holes.

In addition, they had to perform all this process with great care and attention.

While SMT assembly is highly proficient and well organized as in this technology you can solder directly on the board.

This technology does not use any leads to pass through PCBs. So, it is:

  • Extra fast
  • Low cost
  • More efficient.

How SMT Capability is Helpful for Small Devices

SMT capability is very helpful for small devices. Because SMT technology helps to solder the components on the board in a small space.

Hence, they are beneficial for small devices. It is the reason that modern devices are small but they consist of a huge number of features and functions. So, SMT technology is an ideal choice for small but smart appliances.

A Brief History of SMT Technology

As we have already stated that SMT technology was first introduced in 1980.

But it gained great fame and popularity as PCB board producers had realized that SMT technology is more efficient in comparison to old assembly procedures.

They also acknowledged that the devices using PCB boards assembled by SMT technology were extremely advanced and highly efficient.

SMT capability also permits greatly mechanized production. In past, electronic engineers used wires in order to connect the components on PCB boards.

They had used the through-hole method to connect components on the PCB boards.

Moreover, these traditional PCBs also needed humans in order to assist in their manufacturing.

They were needed great attention to design them.

But SMT technology had removed all these tiresome steps.

Moreover, in SMT assembly components were soldered onto the pads on the boards directly. And all this procedure was automated so it had become popular with every passing day.

What are the Specifications of SMT Capability

Here are some great beneficial specifications of SMT capability.

  • Shorter process
  • Matching circuitry from phone PCB to antenna structure
  • Permits space-saving on PCB
  • Optimal integration
  • Available FPC & PCB, SMT on LDS
  • Highly precise material selection
  • Usage of standard low-cost lead-free SMT method
  • High performing procedure
  • Permits full performance of RF testing, prior to phone assembly

SMT Capability has Following Advantages

There are great benefits of SMT capability.

Moreover, SMT technology has the following benefits over some other traditional methods of designing PCBs:

  1. The main benefit of SMT assembly is that it allows automated soldering and production.
  2. It is cost-effective and time-saving
  3. SMT is low cost, so it is also beneficial for low as well as high budget
  4. It has the ability to produce extra consistent circuits
  5. Costs are very low in comparison to through-hole technology
  6. SMT components are extra small
  7. Fewer number holes need to be drilled on circuit boards
  8. Higher density of components
  9. Any side of a circuit board has the ability to place components
  10. Great performance during vibration and shaking conditions

What is the Importance of SMT Capability

Nowadays there is a great importance of SMT capability. All modern electronic appliances are manufacturing by using SMT (Surface Mount Technology).

Because the products and appliances which have used SMT have great advantages in comparison to other traditional methods of PCBs.

Moreover, designers have assigned them the name of surface mount devices.

They are also famous as SMD’s. All of these benefits have made SMT assembly more important in the world of electronic industries.

Placer speed60000chips/hour
SMTThrough-Hole Assembly
Single/Double-Side SMT, Single/Double-Sides Mixture Assembly
PCB Size50mm×50mm ~450mm×406mm
PCB Thickness0.5mm~4.5mm
Min. diameter /space of BGA0.2mm/0.35mm
Minimum width/space of QFP 0.15mm/0.3mm, Minimum Diameter /Space of BGA: 0.2mm/0.35mm
 Reliability TestFlying Probe Test/Fixture test, Impedance Test, Solderability Test, Thermal Shock Test, Hole Resistance Test, and Micro Section Analysis, etc.
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